Increasing circuit functionality and power density in power hybrids

Author

Brucchi, Fabio ; Salvati, Paolo

Author_Institution

SEMIKRON Italia S.r.l, Rome, Italy

Volume

20

Issue

3

fYear

2005

fDate

5/1/2005 12:00:00 AM

Firstpage

671

Lastpage

678

Abstract

A new method to increase circuit functionality and power density per unit area in power electronic modules has been developed. This new method uses the present power hybrids production technology platform on ceramic substrates and implements direct bonded copper (DBC) "partial" multilayer structures on application specific substrates. With this novel approach a more than 50% increased power density and a 40% increased circuit complexity has been achieved. Reliability tests (thermal cycling (TC), power cycling (PC), high temperature reverse bias...) have been performed for several new layout solutions, the most relevant results are shown in this paper.

Keywords

ceramics; integrated circuit manufacture; power integrated circuits; reliability; substrates; ceramic substrates; circuit functionality; direct bonded copper; high temperature reverse bias; partial multilayer structure; power cycling; power density; power electronic modules; power hybrids; power hybrids production technology; reliability test; thermal cycling; Bonding; Ceramics; Circuit testing; Complexity theory; Copper; Nonhomogeneous media; Performance evaluation; Power electronics; Production; Temperature; High temperature reverse bias (HTRB); power cycling (PC); thermal cycling (TC);

fLanguage

English

Journal_Title

Power Electronics, IEEE Transactions on

Publisher

ieee

ISSN

0885-8993

Type

jour

DOI

10.1109/TPEL.2005.846546

Filename

1427825