DocumentCode :
800059
Title :
High-Performance Uniaxially Strained SiGe-on-Insulator pMOSFETs Fabricated by Lateral-Strain-Relaxation Technique
Author :
Irisawa, Toshifumi ; Numata, Toshinori ; Tezuka, Tsutomu ; Usuda, Koji ; Hirashita, Norio ; Sugiyama, Naoharu ; Toyoda, Eiji ; Takagi, Shin-ichi
Author_Institution :
MIRAI-ASET, Kawasaki
Volume :
53
Issue :
11
fYear :
2006
Firstpage :
2809
Lastpage :
2815
Abstract :
Novel uniaxially strained SiGe-on-insulator (SGOI) pMOSFETs with Ge content of 20% have been successfully fabricated by utilizing lateral (uniaxial) strain-relaxation process on globally (biaxially) strained SGOI substrates. Drastic increase of drain current (80%) caused by the change of strain from biaxial to uniaxial and the mobility enhancement of about 100% against the control Si-on-insulator pMOSFETs are observed in SGOI pMOSFET. This high mobility enhancement is maintained in high vertical effective fields as well as in short-channel devices. As a result, significant ION enhancement of 80% is demonstrated in 40-nm gate-length uniaxially strained SGOI pMOSFET
Keywords :
Ge-Si alloys; MOSFET; carrier mobility; nanotechnology; silicon-on-insulator; 40 nm; SGOI pMOSFET; SiGe; SiGe-on-insulator; high-mobility channel; lateral-strain-relaxation technique; mobility enhancement; silicon-on-insulator; uniaxial stress; CMOS technology; Capacitive sensors; Compressive stress; Fabrication; Germanium silicon alloys; MOSFET circuits; Silicon germanium; Silicon on insulator technology; Strain control; Uniaxial strain; High-mobility channel; MOSFET; Si-on-insulator (SOI); SiGe-on-insulator (SGOI); strain relaxation; strained SiGe; uniaxial stress;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2006.884078
Filename :
1715626
Link To Document :
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