• DocumentCode
    80059
  • Title

    Ground Bounce Noise Induced by Crosstalk Noise for Two Parallel Ground Planes With a Narrow Open-Stub Line and Adjacent Signal Traces in Multilayer Package Structure

  • Author

    Guang-Hwa Shiue ; Chi-Lou Yeh ; Pei-Wei Huang ; Huan-Yi Liao ; Zhi-Hao Zhang

  • Author_Institution
    Dept. of Electron. Eng., Chung Yuan Christian Univ., Chungli, Taiwan
  • Volume
    4
  • Issue
    5
  • fYear
    2014
  • fDate
    May-14
  • Firstpage
    870
  • Lastpage
    881
  • Abstract
    This paper investigates how ground bounce noise (GBN) is generated by crosstalk noises for two parallel ground planes with a narrow open-stub line (NOSL) and adjacent signal traces in a multilayer package structure. A noise reduction scheme and design guidelines for preventing intense noises (GBN and coupled noise) are also proposed. A graphical method that is based on wave tracing is also developed to elucidate the generation of crosstalk noise by adjacent signal traces on an NOSL. The mechanism of generation of the GBN by crosstalk noise can be elucidated based on reflection theory, open-stub quarter-wavelength resonance, and parallel-plane resonance. The time-domain simulation results are analyzed using a 3-D full-wave simulator, Computer Simulation Technology. Using an additional shorting via at the connection between the NOSL and parallel ground planes, the proposed noise reduction scheme can significantly reduce the GBN and coupled noise. Moreover, guidelines for designing the test structure to minimize noise (GBN and coupled noise) are presented. Finally, the simulation and measurement results in the time domain are compared to validate the proposed analysis and noise reduction scheme.
  • Keywords
    crosstalk; electron device noise; electronics packaging; integrated circuit layout; network analysis; time-domain analysis; 3D full-wave simulator; GBN; NOSL; adjacent signal traces; computer simulation technology; coupled noise; crosstalk noise; design guidelines; graphical method; ground bounce noise; multilayer package structure; narrow open-stub line; noise reduction scheme; open-stub quarter-wavelength resonance; parallel ground planes; parallel-plane resonance; reflection theory; time-domain simulation; Crosstalk; Impedance; Layout; Metals; Noise; Noise reduction; Nonhomogeneous media; Coupled noise; crosstalk noise; graphic method; ground bounce noise (GBN); narrow open-stub line (NOSL); open-stub quarter-wavelength resonance; parallel-plane resonance; reflection theory; reflection theory.;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2014.2299281
  • Filename
    6727451