DocumentCode :
80135
Title :
Electrothermal-Stress Interactions of LDMOS FET Induced by DCI RF-Pulses
Author :
Weifeng Zhou ; Liang Zhou ; Liang Lin ; Wen-Yan Yin ; Jun-Fa Mao
Author_Institution :
Key Lab. of Minist. of Educ. of Design & Electromagn. Compatibility of High-Speed Electron. Syst., Shanghai Jiao Tong Univ., Shanghai, China
Volume :
56
Issue :
5
fYear :
2014
fDate :
Oct. 2014
Firstpage :
1178
Lastpage :
1184
Abstract :
This paper studies the coupled electrothermal-stress interaction mechanisms of a laterally diffused metal oxide semiconductor field effect transistor under direct current injection radio frequency pulses. Based on the measured threshold breakdown power in the high power microwave experiment, an analytical thermal stress model has been derived. Furthermore, the finite element method is used to calculate the transient temperature and stress profiles in comparison with both analytical results and those from commercial software.
Keywords :
MOSFET; finite element analysis; semiconductor device breakdown; semiconductor device models; thermal stresses; DCI RF-pulses; LDMOS FET; direct current injection radiofrequency pulses; electrothermal stress interactions; finite element method; high power microwave experiment; laterally diffused metal oxide semiconductor field effect transistor; stress profiles; thermal stress model; threshold breakdown power; transient temperature; Field effect transistors; Finite element analysis; Heating; Metals; Stress; Thermal stresses; Transient analysis; Direct current injection (DCI) pulse; electrothermal stress (E-T-S); finite element method (FEM); laterally diffused metal oxide semiconductor (LDMOS) field effect transistor (FET); thermal and stress failure;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/TEMC.2014.2314304
Filename :
6798715
Link To Document :
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