Title :
Internal Stress for Sputtered Sendust Films
Author :
Ishiwata, N. ; Shinkai, S. ; Urai, H.
Author_Institution :
NEC Corporation.
Abstract :
It has become clear that the internal stress (¿) of thermally treated sendust films changes depending on the treatment temperature, the thermal expansion coefficient (¿) of the substrate, and the film oxygen content. The measured value for low-oxygen-content sendust film is 169×10¿7. Values of calculated using the value of for Sendust film show good agreement with measured values.
Keywords :
Annealing; Internal stresses; Magnetic films; Magnetostriction; Stress measurement; Substrates; Temperature; Tensile stress; Thermal expansion; Thermal stresses;
Journal_Title :
Magnetics in Japan, IEEE Translation Journal on
DOI :
10.1109/TJMJ.1992.4565521
