Abstract :
The IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2014) took place October 19 to 22, 2014, in Des Moines, Iowa. It was a great success. A total of 221 papers were accepted representing an acceptance rate of about 67 percent. There were more than 200 participants from 23 countries representing academia, government, and industry. CEIDP was pleased to provide partial financial support to more than 20 research students to assist them to present their research, participate in discussions, and broaden their networks.