DocumentCode :
80216
Title :
Report on CEIDP 2014
Volume :
31
Issue :
2
fYear :
2015
fDate :
March-April 2015
Firstpage :
37
Lastpage :
38
Abstract :
The IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2014) took place October 19 to 22, 2014, in Des Moines, Iowa. It was a great success. A total of 221 papers were accepted representing an acceptance rate of about 67 percent. There were more than 200 participants from 23 countries representing academia, government, and industry. CEIDP was pleased to provide partial financial support to more than 20 research students to assist them to present their research, participate in discussions, and broaden their networks.
fLanguage :
English
Journal_Title :
Electrical Insulation Magazine, IEEE
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2015.7048137
Filename :
7048137
Link To Document :
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