• DocumentCode
    80216
  • Title

    Report on CEIDP 2014

  • Volume
    31
  • Issue
    2
  • fYear
    2015
  • fDate
    March-April 2015
  • Firstpage
    37
  • Lastpage
    38
  • Abstract
    The IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2014) took place October 19 to 22, 2014, in Des Moines, Iowa. It was a great success. A total of 221 papers were accepted representing an acceptance rate of about 67 percent. There were more than 200 participants from 23 countries representing academia, government, and industry. CEIDP was pleased to provide partial financial support to more than 20 research students to assist them to present their research, participate in discussions, and broaden their networks.
  • fLanguage
    English
  • Journal_Title
    Electrical Insulation Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    0883-7554
  • Type

    jour

  • DOI
    10.1109/MEI.2015.7048137
  • Filename
    7048137