Title :
Efficient EMC Simulation of enclosures with apertures residing in an electrically large platform using the MM-UTD method
Author :
Wei, X.C. ; Li, Er-Ping
Author_Institution :
Comput. Electromagn. & Electron. Div., Nat. Univ. of Singapore, Singapore
Abstract :
The moment method coupled with the uniform theory of diffraction is employed in this paper to simulate the electromagnetic shielding performance of an enclosure with apertures residing in a very large platform, in which the moment method is used to accurately model the enclosure with apertures, and the influence of the large platform is efficiently calculated by using the uniform theory of diffraction. These two methods are coupled through the tangential electromagnetic fields on the apertures of the enclosure. In this paper, the accuracy of this coupled method developed is validated, and we apply this method for simulating the shielding effectiveness with the sources inside/outside the enclosure. The simulation results show that this coupled technique is able to simultaneously model the effects of the smaller structures and the large platform on the total electromagnetic property. It further demonstrates that this coupled method is a very flexible and powerful technique for analysis of the electromagnetic compatibility problems with smaller objects mounted on a larger platform.
Keywords :
electromagnetic compatibility; electromagnetic shielding; geometrical theory of diffraction; method of moments; EMC simulation; coupled method developed; electromagnetic compatibility; electromagnetic shielding; moment method; tangential electromagnetic fields; uniform theory of diffraction; Apertures; Electromagnetic compatibility; Electromagnetic coupling; Electromagnetic fields; Electromagnetic modeling; Electromagnetic radiation; Electromagnetic shielding; Electromagnetic waveguides; Moment methods; Physical theory of diffraction; Electromagnetic shielding simulation; moment method (MM); uniform theory of diffraction (UTD);
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
DOI :
10.1109/TEMC.2005.857361