• DocumentCode
    802743
  • Title

    Solder-assembled large MEMS flaps for fluid mixing

  • Author

    Ma, Zhichun ; Bradley, Elizabeth ; Peacock, Thomas ; Hertzberg, Jean R. ; Lee, Yung-Cheng

  • Author_Institution
    Univ. of Colorado, Boulder, CO, USA
  • Volume
    26
  • Issue
    3
  • fYear
    2003
  • Firstpage
    268
  • Lastpage
    276
  • Abstract
    We describe surface-micromachined thermal actuator-based micro-electro-mechanical systems (MEMS) flaps with a length scale of 1,000 μm. These flaps were developed for the enhancement of fluid mixing in an experimental study of a planar air jet. The scales of the flow physics required the actuators to be much larger than the typical MEMS scales, and the experiment required an array of 10 flaps (1 cm in length) to be soldered onto a ceramic substrate with high precision. These unusual requirements made it difficult to achieve good assembly yields that could provide large deflections. To improve the yields and deflections, we modified the initial flap design by reducing the size of the solder pads, removing sharp corners, changing the number and the width of the actuator´s hot arms, and strengthening the support beams. In addition, we developed a controllable assembly process to reflow tin/lead solder on gold pads, and we used numerical simulations extensively in the design process to improve the performance. The experimental measurements corroborated these simulations: the deflection was increased from 6.4 to 11.1 μm under a 5 V applied voltage. Flow velocity measurements showed that these MEMS flaps amplified the natural instabilities of the planar jet.
  • Keywords
    arrays; flip-chip devices; flow control; flow instability; flow simulation; jets; microactuators; microfluidics; micromachining; mixing; reflow soldering; 1 cm; 1000 micron; 5 V; actuator hot arms; array; assembly yields; ceramic substrate; controllable assembly process; flap-tip deflection; flip-chip; flow physics scales; flow velocity measurements; fluid flow control; fluid mixing; gold pads; high precision; large deflections; natural instability amplification; numerical simulations; planar air jet; planar jet; solder pad size; solder reflow; solder-assembled large MEMS flaps; support beams; surface-micromachined thermal actuator-based MEMS flaps; Actuators; Arm; Assembly; Ceramics; Lead; Microelectromechanical systems; Micromechanical devices; Physics; Process control; Tin;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2003.817966
  • Filename
    1236527