DocumentCode
803416
Title
Failure analysis of InGaAs/GaAs strained-Layer quantum-well lasers using a digital OBIC monitor
Author
Takeshita, Tatsuya ; Sugo, Mitsuru ; Sasaki, Toru ; Tohmori, Yuichi
Author_Institution
NTT Photonics Labs., NTT Corp., Kanagawa, Japan
Volume
53
Issue
2
fYear
2006
Firstpage
211
Lastpage
217
Abstract
The mechanisms that cause the sudden failure of InGaAs/GaAs strained-layer quantum-well lasers (LD) are analyzed by monitoring an optical beam-induced current (OBIC). Statistically, the LDs that suddenly fail have different n-OBICridge intensity profiles (p-n junction OBIC under the ridge normalized by that under the electrode) from LDs with conventional catastrophic optical damage. It appears that dislocations are generated in the vicinity of an antireflection (AR) facet and extend to the AR facet, and meltdown finally occurs there. The suppression of dislocation generation around the AR facet is important in regards to preventing sudden failure.
Keywords
III-V semiconductors; OBIC; condition monitoring; failure analysis; gallium arsenide; indium compounds; quantum well lasers; semiconductor device reliability; InGaAs-GaAs; antireflection facet; catastrophic optical damage; digital OBIC monitoring; dislocation generation; failure analysis; optical beam-induced current monitoring; p-n junctions; quantum well lasers; semiconductor lasers; Condition monitoring; Degradation; Failure analysis; Gallium arsenide; Indium gallium arsenide; Optical pumping; Optical saturation; Optical sensors; Quantum well lasers; Wavelength measurement; Aging; failure analysis; indium compounds; photon beams; quantum-well lasers; reliability; ridge waveguides; semiconductor lasers;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2005.862238
Filename
1580856
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