Meniscus coating: a low-cost polymer deposition method for system-on-package (SOP) substrates

Author

Bhattacharya, Swapan K. ; Moon, Kyoung S. ; Tummala, Rao R. ; May, Gary S.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

26

Issue

2

fYear

2003

fDate

4/1/2003 12:00:00 AM

Firstpage

110

Lastpage

114

Abstract

Meniscus coating is a low-cost deposition method that can be used to apply polymers in solution as thin films to the surface of electronics packaging substrates or flat panel displays. Most Roadmaps in electronics packaging project 6 to 8 μm lines and spaces for next generation high density printed wiring board (PWB) substrates in the year 2006, which would require coating thickness of similar magnitudes for manufacturing fine lines with higher yield. Meniscus coating can be an enabling deposition method that can provide finer yet uniform coating on large area substrates which would translate to patterning finer copper traces, thereby increasing the wiring density. This paper reports preliminary results on coating thickness that can be achieved with photoresists, dielectrics, and solder masks which are the integral parts of the sequential build up multi-layer process for the system-on-package substrates.

Keywords

coating techniques; contact angle; dielectric thin films; masks; multichip modules; photoresists; polymer films; substrates; surface tension; MCM; SOP substrates; coating thickness; dielectrics; electronics packaging substrates; low-cost polymer deposition method; meniscus coating; multi-layer process; photoresists; solder masks; system-on-package substrates; thin films; Coatings; Copper; Dielectric substrates; Electronics packaging; Flat panel displays; Manufacturing; Polymer films; Resists; Sputtering; Wiring;

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/TEPM.2003.817718

Filename

1236875