DocumentCode :
803722
Title :
Punch-through in short-channel AlGaN/GaN HFETs
Author :
Uren, M.J. ; Nash, K.J. ; Balmer, R.S. ; Martin, T. ; Morvan, E. ; Caillas, N. ; Delage, S.L. ; Ducatteau, D. ; Grimbert, B. ; De Jaeger, J.C.
Author_Institution :
QinetiQ Ltd, UK
Volume :
53
Issue :
2
fYear :
2006
Firstpage :
395
Lastpage :
398
Abstract :
Short-channel punch-through effects are demonstrated in 0.17 μm gate length AlGaN/GaN single heterojunction field-effect transistors. These take the form of a high output conductance and the strong dependence of pinch-off voltage on drain voltage. It is shown by simulation that they can be explained by poor confinement of charge at the AlGaN/GaN interface resulting in current flow within the bulk of the GaN layer. This is caused by there being a concentration of only ∼1.5×1016 cm-3 deep levels in the insulating GaN buffer layer. It is found that a net acceptor density of around 1017 cm-3 is required to ensure suppression of short-channel effects.
Keywords :
III-V semiconductors; aluminium compounds; buffer layers; gallium compounds; high electron mobility transistors; wide band gap semiconductors; 0.17 micron; AlGaN-GaN; AlGaN/GaN HFET; buffer layer; drain voltage; heterojunction field-effect transistors; high output conductance; net acceptor density; pinch-off voltage; punch-through effects; short-channel effects; Aluminum gallium nitride; Buffer layers; Carrier confinement; FETs; Gallium nitride; HEMTs; Heterojunctions; Insulation; MODFETs; Voltage; Drain-induced barrier lowering (DIBL); GaN HEMT; GaN heterojunction field-effect transistors (HFET); punch-through; short-channel effects;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2005.862702
Filename :
1580880
Link To Document :
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