DocumentCode
805611
Title
Setting the trap for hot carriers [MOS VLSI]
Author
Aur, S. ; Duvvury, C. ; Hunter, W.R.
Author_Institution
Semicond. Process & Device Center, Texas Instrum. Inc., Dallas, TX, USA
Volume
11
Issue
4
fYear
1995
fDate
7/1/1995 12:00:00 AM
Firstpage
18
Lastpage
24
Abstract
The device degradation under ac and dc stress have been discussed and a relationship between the two has been established,. We have shown that the commonly used lifetime criteria of 10% linear current degradation for 10 years for a transistor under dc stress is overly conservative for representing the circuit operating lifetime. Using experimental and simulated data for inverter chains, we proposed that a meaningful equivalent lifetime based on 10% I/sub dl/ degradation under dc stress is 1 year lifetime (for a 10 year circuit lifetime based on 54b degradation in ring oscillator frequency). We also compared this criteria to actual circuit degradation for microprocessors and a DRAM. For DSP microprocessors with 0.8 μm LDD transistors, the projected lifetime was more than 200 years at 5.5 V, with a corresponding 10% I/sub dr/ lifetime of 20 years. For 1 Mb DRAMs with 1 pm LDD transistors, the 5% speed degradation lifetime at 5.5 V was more than 100 years, whereas the individual transistors had 10% I/sub dl/ lifetime of 4 years. These circuit results support the 10% I/sub dl/ transistor lifetime. We believe these criterion should be very safe and reasonable for digital IC chips currently in the field, as well as those in future design and development.
Keywords
MOS digital integrated circuits; VLSI; hot carriers; integrated circuit reliability; 5.5 V; DRAM; DSP microprocessors; MOS circuits; VLSI; circuit operating lifetime; device degradation; digital IC chips; hot carriers; inverter chains; lifetime criteria; linear current degradation; ring oscillator; Circuit simulation; Degradation; Frequency; Hot carriers; Inverters; Microprocessors; Random access memory; Ring oscillators; Stress; Very large scale integration;
fLanguage
English
Journal_Title
Circuits and Devices Magazine, IEEE
Publisher
ieee
ISSN
8755-3996
Type
jour
DOI
10.1109/101.395192
Filename
395192
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