Title :
Combined differential and static pressure sensor based on a double-bridged structure
Author :
Pedersen, Casper ; Jespersen, Simon T. ; Krog, Jens Peter ; Christensen, Carsten ; Thomsen, Erik V.
Author_Institution :
Grundfos A/S, Bjerringbro, Denmark
fDate :
6/1/2005 12:00:00 AM
Abstract :
A combined differential and static silicon microelectromechanical system pressure sensor based on a double piezoresistive Wheatstone bridge structure is presented. The developed sensor has a conventional (inner) bridge on a micromachined diaphragm and a secondary (outer) bridge on the chip substrate. A novel approach is demonstrated with a combined measurement of outputs from the two bridges, which results in a combined deduction of both differential and static media pressure. Also following this new approach, a significant improvement in differential pressure sensor accuracy is achieved. Output from the two bridges depends linearly on both differential and absolute (relative to atmospheric pressure) media pressure. Furthermore, the sensor stress distributions involved are studied by three-dimensional finite-element (FE) stress analysis. Furthermore, the FE analysis evaluates current and other potential piezoresistor positions on the outer Wheatstone bridge.
Keywords :
bridge circuits; finite element analysis; micromachining; microsensors; piezoresistive devices; pressure measurement; pressure sensors; stress analysis; Wheatstone bridge; atmospheric pressure; chip substrate; combined pressure sensors; double-bridged structure; finite-element stress analysis; media pressure; micromachined diaphragm; piezoresistive structure; potential piezoresistor positions; pressure sensor; sensor stress distributions; silicon microelectromechanical system; Atmospheric measurements; Bridge circuits; Iron; Microelectromechanical systems; Piezoresistance; Pressure measurement; Semiconductor device measurement; Sensor systems; Silicon; Stress; Combined pressure sensors; O-ring; Wheatstone; double-bridge; finite element (FE); microelectromechanical system (MEMS); piezoresistive; silicon; stress;
Journal_Title :
Sensors Journal, IEEE
DOI :
10.1109/JSEN.2005.845199