DocumentCode :
807518
Title :
Whisker test methods of JEITA whisker growth mechanism for test methods
Author :
Sakamoto, Ichizo
Author_Institution :
Japan Electron. & Inf. Technol. Industries Assoc., Kusatsu-City, Japan
Volume :
28
Issue :
1
fYear :
2005
Firstpage :
10
Lastpage :
16
Abstract :
As the industry moves toward lead-free electronics, a replacement for the traditional tin-lead plating is required. Pure tin is the coating of choice for many suppliers, but there is a well-known problem with the growth of tin whiskers. A whisker is comprised of a tin crystal which, after an incubation period, grows with time. Whiskers may grow long enough to cause shorts in electronic circuits. A test method is required for evaluating the reliability risk inherent in tin whiskers. The Japanese government requested the Japan Electronics and Information Technology Industries Association (JEITA) to establish test methods for solderability, reliability, whisker, and migration for lead-free electronics. The goal of this subcommittee was to propose the test methods for tin whiskers by March 2004. The committee carried out a literature survey, and developed hypotheses for whisker growth, which was then applied to test methods. Two types of studies were undertaken. One is a fundamental study to verify the hypothesis. The other looked at accelerated tests to develop recommended test conditions. As a result, we found that the diffusion of copper, oxidation, and thermal cycling all influence tin whisker growth. This paper describes the results of the fundamental studies and reports on the JEITA whisker growth mechanism.
Keywords :
crystal growth; life testing; reliability; whiskers (crystal); JEITA; accelerated tests; copper diffusion; electronic circuits; lead-free electronics; leadframe package; oxidation; reliability risk; solderability; thermal cycling; tin whisker growth; tin whiskers; tin-lead plating; whisker growth mechanism; whisker test methods; Circuit testing; Coatings; Electronic circuits; Electronic equipment testing; Electronics industry; Environmentally friendly manufacturing techniques; Government; Industrial electronics; Lead; Tin; Leadframe package; pb-free plating finish; tin whiskers; whisker growth;
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2005.847436
Filename :
1430805
Link To Document :
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