Sea of polymer pillars: compliant wafer-level electrical-optical chip I/O interconnections

Author

Bakir, M.S. ; Gaylord, T.K. ; Martin, K.P. ; Meindl, J.D.

Author_Institution

Microelectron. Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

Volume

15

Issue

11

fYear

2003

Firstpage

1567

Lastpage

1569

Abstract

An electrical-optical chip input-output (I/O) interconnection technology called sea of polymer pillars (SoPP) is presented. SoPP provides highly process-integrated and mechanically flexible (compliant) electrical-optical die-to-board interconnections that mitigate thermo-mechanical expansion mismatches. The I/O density of SoPP exceeds 10⁵/cm². The compliance of the polymer pillars is shown to be 3-5 μm/mN. Approximately 50% input optical coupling efficiency into a volume grating coupler through a set of polymer pillars is demonstrated.

Keywords

diffraction gratings; integrated circuit interconnections; integrated optoelectronics; optical couplers; optical interconnections; optical planar waveguides; optical polymers; printed circuit accessories; thermal management (packaging); 50 percent; I/O density; compliant wafer-level electrical-optical chip I/O interconnections; electrical-optical chip input-output interconnection technology; highly process-integrated die-to-board interconnections; input optical coupling efficiency; mechanically flexible electrical-optical die-to-board interconnections; optical polymers; sea of polymer pillars; thermo-mechanical expansion mismatches; volume grating coupler; Electron optics; Optical coupling; Optical interconnections; Optical polymers; Optical refraction; Optical surface waves; Optical waveguides; Scanning electron microscopy; Sockets; Surface waves;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2003.818651

Filename

1237590