Title :
Electrical-Thermal Co-Simulation for DC IR-Drop Analysis of Large-Scale Power Delivery
Author :
Tianjian Lu ; Jian-Ming Jin
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Abstract :
For accurate DC IR-drop analysis of integrated circuits, electrical-thermal co-simulation is necessary to consider the effect of Joule heating. A suitable numerical method for this co-simulation is the finite element method (FEM) because of its capabilities in modeling complex geometries and materials. To deal with large-scale problems, a domain decomposition scheme is applied to the FEM to enable simulation with multiple processors in parallel and achieve significant reduction in computation time.
Keywords :
finite element analysis; large-scale systems; microprocessor chips; DC IR-drop analysis; FEM; Joule heating; complex geometry; complex materials; domain decomposition; electrical-thermal co-simulation; finite element method; integrated circuits; large-scale power delivery; large-scale problems; multiple processors; Arrays; Boundary conditions; Finite element analysis; Program processors; Resistance heating; Through-silicon vias; Electrical-thermal co-simulation; finite element method; finite element tearing and interconnecting; on-chip power grid; parallel computing; power delivery; through silicon vias (TSVs);
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
DOI :
10.1109/TCPMT.2013.2275271
