Author :
Walke, Amey Mahadev ; Vandooren, A. ; Rooyackers, R. ; Leonelli, Daniele ; Hikavyy, Andriy ; Loo, Roger ; Verhulst, Anne S. ; Kuo-Hsing Kao ; Huyghebaert, Cedric ; Groeseneken, Guido ; Rao, Valipe Ramgopal ; Bhuwalka, Krishna K. ; Heyns, M.M. ; Collaert,
Abstract :
This paper presents a new integration scheme to fabricate a Si/Si0.55Ge0.45 heterojunction line tunnel field effect transistor (TFET). The device shows an increase in tunneling current with gate length. The 1- μm gate length device shows on current in excess of 20 μA/μm at VGS=VDS=1.2 V. Low-temperature measurements, performed to suppress trap-assisted tunneling (TAT), reveal the point subthreshold swing as low as 22 mV/dec at 78 K. Field-induced quantum confinement effects are found to increase the tunneling onset voltage by ~ 0.35 V. Variation of the tunneling onset voltage measured experimentally is correlated to variation in the pocket thickness and its doping concentration. Small geometry devices were found to be more susceptible to microvariations in the pocket thickness and doping concentration.
Keywords :
Ge-Si alloys; cryogenic electronics; high electron mobility transistors; semiconductor doping; temperature measurement; tunnel transistors; Si-Si0.55Ge0.45; TAT suppression; TFET; doping concentration; field-induced quantum confinement effects; gate length; heterojunction line tunnel field effect transistor; low-temperature measurements; microvariations; pocket thickness; point subthreshold swing; small geometry devices; temperature 78 K; trap-assisted tunneling suppression; tunneling current; tunneling onset voltage; voltage 0.35 V; voltage 1.2 V; Doping; Fabrication; Logic gates; Semiconductor process modeling; Silicon; Silicon germanium; Tunneling; FIQC effect; Field-induced quantum confinement (FIQC); TFET fabrication; TFET simulations; TFET variability; gate length and width dependence; line tunneling; tunnel field effect transistor (TFET);