DocumentCode :
808415
Title :
IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
Volume :
29
Issue :
1
fYear :
2006
Abstract :
Provides instructions and guidelines to prospective authors who wish to submit manuscripts.
fLanguage :
English
Journal_Title :
Electronics Packaging Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2006.870203
Filename :
1583790
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=808415