• DocumentCode
    808618
  • Title

    Localisation of devices acting as heat sources in ICs covered entirely by metal layers

  • Author

    Altet, J. ; Salhi, M.A. ; Dilhaire, S. ; Syal, A. ; Ivanov, A.

  • Author_Institution
    Electron. Eng. Dept., Univ. Politecnica de Catalunya, Barcelona, Spain
  • Volume
    39
  • Issue
    20
  • fYear
    2003
  • Firstpage
    1440
  • Lastpage
    1442
  • Abstract
    The feasibility is shown of using the dynamic monitoring of the displacement of the uppermost metal layer due to thermal dilatations to locate devices that generate hot spots in a CMOS IC layout with five levels of metals and with metal fills.
  • Keywords
    CMOS integrated circuits; integrated circuit layout; integrated circuit measurement; integrated circuit reliability; monitoring; CMOS IC; IC layout; dynamic monitoring; heat sources; hot spots; localisation; metal fills; metal layers; thermal dilatations; uppermost metal layer;
  • fLanguage
    English
  • Journal_Title
    Electronics Letters
  • Publisher
    iet
  • ISSN
    0013-5194
  • Type

    jour

  • DOI
    10.1049/el:20030907
  • Filename
    1238590
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=808618