Title :
Localisation of devices acting as heat sources in ICs covered entirely by metal layers
Author :
Altet, J. ; Salhi, M.A. ; Dilhaire, S. ; Syal, A. ; Ivanov, A.
Author_Institution :
Electron. Eng. Dept., Univ. Politecnica de Catalunya, Barcelona, Spain
Abstract :
The feasibility is shown of using the dynamic monitoring of the displacement of the uppermost metal layer due to thermal dilatations to locate devices that generate hot spots in a CMOS IC layout with five levels of metals and with metal fills.
Keywords :
CMOS integrated circuits; integrated circuit layout; integrated circuit measurement; integrated circuit reliability; monitoring; CMOS IC; IC layout; dynamic monitoring; heat sources; hot spots; localisation; metal fills; metal layers; thermal dilatations; uppermost metal layer;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:20030907
