Book review

The requirements of higher bandwidth and lower power consumption of electronic systems render the integration of circuits and electronic packages increasingly complex. In particular, the introduction of three-dimensional (3D) structures based on through-silicon via (TSV) technology provides a potential solution to reduce the size and to increase the performance of these systems. As a consequence, the electromagnetic compatibility (EMC) between circuits, signal integrity (SI) and power integrity (PI) in electronic integration is of vital importance. For this reason, the electronic circuits and packaging systems must be designed by taking into account the trade-offs between cost and performance. This requires a specific knowledge and many years of research work in the fields of modeling and simulation of signal integrity, power integrity and EMC in electronic package integration and multilayered printed circuit boards. The author and his contributors share their knowledge with readers in a systematic and rigorous way in the 366 pages of this book.