• DocumentCode
    80937
  • Title

    Highly Laminated Soft Magnetic Electroplated CoNiFe Thick Films

  • Author

    Jooncheol Kim ; Minsoo Kim ; Herrault, Florian ; Jae Park ; Allen, Mark G.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    4
  • fYear
    2013
  • fDate
    2013
  • Firstpage
    5000204
  • Lastpage
    5000204
  • Abstract
    The fabrication and characterization of highly laminated (~40 layers), thick (~40 μm) films of magnetically soft cobalt-nickel-iron are presented. Thick film fabrication is based on automated sequential electrodeposition of alternating CoNiFe and copper layers, followed by selective copper removal. The film, comprised tens of 1 μm thick laminations, exhibits saturation flux density of 1.8 T and coercivity of approximately 1.3 Oe. High-frequency film characterization took place in a 36-turn test inductor, which demonstrated constant inductance of 1.6 μH up to 10 MHz, indicating suppressed eddy-current loss. Quality factor exceeding 40 at 1 MHz, surpassing the performance of similarly fabricated Permalloy (Ni80Fe20) films.
  • Keywords
    Permalloy; coercive force; electroplating; laminates; magnetic thin films; CoNiFe; Permalloy films; automated sequential electrodeposition; coercivity; eddy-current loss; highly laminated soft magnetic electroplated thick films; saturation flux density; Coercive force; Copper; Lamination; Magnetic cores; Magnetic multilayers; Saturation magnetization; Soft magnetic materials; Soft magnetic materials; eddy-current losses; laminated CoNiFe film; magnetic core inductor;
  • fLanguage
    English
  • Journal_Title
    Magnetics Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1949-307X
  • Type

    jour

  • DOI
    10.1109/LMAG.2013.2284757
  • Filename
    6655912