Understanding IC lithography

Author

Ziger, David H.

Author_Institution

AT&T Bell Lab., Allentown, PA, USA

Volume

8

Issue

5

fYear

1992

Firstpage

42

Lastpage

47

Abstract

Factors such as minimum resolution overlay tolerances and maximum topography are key elements of IC fabrication. Circuit designers must understand the techniques lithographers use in manufacturing ICs. An overview of the resist work performed at SEMATECH, including resist characterization, process control, and modeling, and a look at future lithography trends are presented. Swing curve, exposure/focus latitude, contrast, reflective notching, development rate, and plasma and thermal resistance measurement procedures for performing resist evaluations are discussed.<>

Keywords

integrated circuit manufacture; integrated circuit technology; lithography; process control; IC fabrication; IC lithography; SEMATECH; contrast; development rate; exposure/focus latitude; manufacturing; maximum topography; minimum resolution overlay tolerances; modeling; process control; reflective notching; resist characterization; resist work; swing curve; thermal resistance measurement; Circuits; Fabrication; Lithography; Manufacturing; Plasma materials processing; Plasma measurements; Process control; Resists; Surfaces; Thermal resistance;

fLanguage

English

Journal_Title

Circuits and Devices Magazine, IEEE

Publisher

ieee

ISSN

8755-3996

Type

jour

DOI

10.1109/101.158512

Filename

158512