Title :
Understanding IC lithography
Author_Institution :
AT&T Bell Lab., Allentown, PA, USA
Abstract :
Factors such as minimum resolution overlay tolerances and maximum topography are key elements of IC fabrication. Circuit designers must understand the techniques lithographers use in manufacturing ICs. An overview of the resist work performed at SEMATECH, including resist characterization, process control, and modeling, and a look at future lithography trends are presented. Swing curve, exposure/focus latitude, contrast, reflective notching, development rate, and plasma and thermal resistance measurement procedures for performing resist evaluations are discussed.<>
Keywords :
integrated circuit manufacture; integrated circuit technology; lithography; process control; IC fabrication; IC lithography; SEMATECH; contrast; development rate; exposure/focus latitude; manufacturing; maximum topography; minimum resolution overlay tolerances; modeling; process control; reflective notching; resist characterization; resist work; swing curve; thermal resistance measurement; Circuits; Fabrication; Lithography; Manufacturing; Plasma materials processing; Plasma measurements; Process control; Resists; Surfaces; Thermal resistance;
Journal_Title :
Circuits and Devices Magazine, IEEE
