DocumentCode :
810923
Title :
Implementation of active interposer for high-speed and low-cost chip level optical interconnects
Author :
Mikawa, Takashi ; Kinoshita, Masao ; Hiruma, Kenji ; Ishitsuka, Takeshi ; Okabe, Masahiro ; Hiramatsu, Seiki ; Furuyama, Hideto ; Matsui, Teruhito ; Kumai, Koichi ; Ibaragi, Osamu ; Bonkohara, Manabu
Author_Institution :
Electron. Syst. Integration Dept., ASET, Tokyo, Japan
Volume :
9
Issue :
2
fYear :
2003
Firstpage :
452
Lastpage :
459
Abstract :
A novel optoelectronic input/output interface module termed "active interposer" and polymeric waveguide film lamination technologies have been developed for optical interconnects between large-scale integration chips. The fabricated active interposers comprise vertical cavity surface emitting lasers, metal-semiconductor-metal photodiodes, submount, and Si circuits stacked via through-hole electrodes built inside the optoelectronic devices and submounted to achieve high-speed low-crosstalk noise and high-density interconnect performances. Also, waveguide film lamination technologies developed are capable of cost reductions. This paper describes the prototype demonstration of the active interposers assembled on the waveguide film-laminated printed circuit boards. Processing and test results of the fabricated optoelectronic devices suitable for three-dimensional stacking are also addressed.
Keywords :
integrated circuit interconnections; integrated optics; integrated optoelectronics; metal-semiconductor-metal structures; optical arrays; optical crosstalk; optical interconnections; optical polymers; optical waveguides; photodiodes; printed circuit accessories; surface emitting lasers; Si circuits; active interposer; high-density interconnect performance; high-speed low-cost chip level optical interconnects; high-speed low-crosstalk noise; large-scale integration chips; metal-semiconductor-metal photodiodes; optoelectronic input/output interface module; polymeric waveguide film lamination technologies; submount; three-dimensional stacking; through-hole electrodes; vertical cavity surface emitting lasers; waveguide film lamination technologies; waveguide film-laminated printed circuit boards; Lamination; Large scale integration; Optical films; Optical interconnections; Optical polymers; Optical surface waves; Optical waveguides; Optoelectronic devices; Polymer films; Vertical cavity surface emitting lasers;
fLanguage :
English
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
Publisher :
ieee
ISSN :
1077-260X
Type :
jour
DOI :
10.1109/JSTQE.2003.814945
Filename :
1239012
Link To Document :
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