Title :
Low-cost microoptical modules for MCM level optical interconnections
Author :
Debaes, Christof ; Vervaeke, Michael ; Baukens, Valérie ; Ottevaere, Heidi ; Vynck, Pedro ; Tuteleers, Patrik ; Volckaerts, Bart ; Meeus, Wim ; Brunfaut, Marnik ; Van Campenhout, Jan ; Hermanne, Alex ; Thienpont, Hugo
Author_Institution :
Dept. of Appl. Phys. & Photonics, Vrije Univ., Brussels, Belgium
Abstract :
A multichannel free-space microoptical module for dense MCM-level optical interconnections has been designed and fabricated. Extensive modeling proves that the module is scalable with a potential for multi-Tb/s·cm2 aggregate bit rate capacity while alignment and fabrication tolerances are compatible with present-day mass replication techniques. The microoptical module is an assembly of refractive lenslet-arrays and a high-quality microprism. Both components are prototyped using deep lithography with protons and are monolithically integrated using a vacuum casting replication technique. The resulting 16-channel high optical-grade plastic module shows optical transfer efficiencies of 46% and inter-channel cross talks as low as -22 dB, sufficient to establish workable multichannel MCM-level interconnections. This microoptical module was used in a feasibility demonstrator to establish intra-chip optical interconnections on a 0.6 μm CMOS optoelectronic field programmable gate array. This optoelectronic chip combines fully functional digital logic, driver and receiver circuitry and flip-chipped VCSEL and detector arrays. With this test-vehicle multichannel on-chip data-communication has been achieved for the first time to our knowledge. The bit rate per channel was limited to 10 Mb/s because of the limited speed of the chip tester.
Keywords :
CMOS logic circuits; casting; field programmable gate arrays; flip-chip devices; integrated optoelectronics; ion beam lithography; micro-optics; microlenses; multichip modules; optical arrays; optical crosstalk; optical fabrication; optical interconnections; optical prisms; replica techniques; surface emitting lasers; 10 Mbit/s; 16-channel high optical-grade plastic module; 46 percent; CMOS optoelectronic field programmable gate array; aggregate bit rate capacity; alignment tolerances; assembly; bit rate per channel; chip tester; dense MCM-level optical interconnections; detector arrays; driver; fabrication tolerances; feasibility demonstrator; flip-chipped VCSEL; fully functional digital logic; high-quality microprism; inter-channel cross talks; intra-chip optical interconnections; limited speed; low-cost microoptical modules; modeling; monolithically integrated components; multichannel free-space microoptical module; multichannel on-chip data-communication; optical transfer efficiencies; optoelectronic chip; present-day mass replication techniques; proton deep lithography; receiver circuitry; refractive lenslet-arrays; test-vehicle; vacuum casting replication technique; Aggregates; Bit rate; Circuit testing; Logic arrays; Optical arrays; Optical design; Optical interconnections; Optical receivers; Optical refraction; Programmable logic arrays;
Journal_Title :
Selected Topics in Quantum Electronics, IEEE Journal of
DOI :
10.1109/JSTQE.2003.813316