Title :
Compact Model of Current Collapse in Heterostructure Field-Effect Transistors
Author :
Koudymov, A. ; Shur, M.S. ; Simin, G.
Author_Institution :
Dept. of Electr., Comput., & Syst. Eng., Rensselaer Polytech. Inst., Troy, NY
fDate :
5/1/2007 12:00:00 AM
Abstract :
In this paper, compact analytical model for the heterostructure field-effect transistor (HFET) current-voltage (I-V) characteristics, accounting for the large-signal dispersion, also referred to as current collapse, is presented. The model is based upon an experimentally established fact that the dispersion is mainly due to carrier trapping at the source and drain sides of the gate edges. In wide-bandgap heterostructures like AlGaN/GaN, the characteristic trapping-generation times are several orders of magnitude longer than the signal period at typical operating frequencies. Thus, the radio frequency signal "sees" an averaged I-V characteristic resulting from carrier trapping-generation. The approach, based on this difference, leads to a compact quasi-steady-state analytical model of the HFET I -V characteristics that can be easily implemented in device-circuit simulators. The model shows close agreement with the experimental data
Keywords :
III-V semiconductors; aluminium compounds; gallium compounds; high electron mobility transistors; semiconductor device models; wide band gap semiconductors; AlGaN-GaN; carrier trapping-generation; characteristic trapping-generation times; compact analytical model; compact quasi-steady-state analytical model; current collapse; current-voltage characteristics; device-circuit simulators; heterostructure field-effect transistor; high-electron mobility transistor; large-signal dispersion; radio frequency signal; wide-bandgap heterostructures; Aluminum gallium nitride; Analytical models; Degradation; Gallium nitride; HEMTs; MODFETs; RF signals; Radio frequency; Switches; Threshold voltage; Compact modeling; GaN; RF; current collapse; heterostructure field-effect transistor (HFET); high-electron mobility transistor (HEMT);
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2007.895389