DocumentCode :
811148
Title :
Impacts of Notched-Gate Structure on Contact Etch Stop Layer (CESL) Stressed 90-nm nMOSFET
Author :
Lin, Chien-Ting ; Fang, Yean-Kuen ; Yeh, Wen-Kuan ; Lai, Chieh-Ming ; Hsu, Che-Hua ; Cheng, Li-Wei ; Ma, Guang Hwa
Author_Institution :
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan
Volume :
28
Issue :
5
fYear :
2007
fDate :
5/1/2007 12:00:00 AM
Firstpage :
376
Lastpage :
378
Abstract :
In this letter, mobility improvements by stress contact etch stop layer (CESL) in a strained 90-nm nMOSFET, with and without notched-gate structure, were studied in detail. Compared to the conventional vertical gate, a device with notched gate shows an extra 7% NMOS ION enhancement for the increased stress in the channel region and the less effect of the halo-implanted impurity on channel. Both simulations with TCAD software and measurements confirm that the notched-gate structure efficiently enhances the generation of high tensile stress on the channel region from the CESL and more localized pocket implant
Keywords :
MOSFET; carrier mobility; ion implantation; 90 nm; TCAD software; halo-implanted impurity; high tensile stress generation; localized pocket implant; mobility improvements; nMOSFET; notched-gate structure; stress contact etch stop layer; stress engineering; CMOS technology; Etching; Implants; Impurities; MOS devices; MOSFET circuits; Microelectronics; Parasitic capacitance; Stress measurement; Tensile stress; Contact etch stop layer (CESL) stresses; mobility enhancement; notched gate; stress engineering;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2007.895425
Filename :
4160031
Link To Document :
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