Title :
Tip-chip bonding: solder bonding to the sides of substrates
Author :
Chan, W.K. ; Yi-Yan, A. ; Bhat, Ritesh
Author_Institution :
Bellcore, Red Bank, NJ, USA
Abstract :
A method of butt coupling a photodetector chip to the output facet of waveguides by solder bonding is described. The critical step of defining contact pads on the facet that are well aligned to the waveguides is carried out with a temporary shadow mask fabricated in situ. All of the light emerging from the waveguide is collected with little sensitivity to wavelength, polarisation and details of the device structure.
Keywords :
integrated optics; integrated optoelectronics; optical waveguides; optical workshop techniques; photodetectors; soldering; butt coupling; contact pads; photodetector chip; solder bonding; temporary shadow mask; tip chip bonding; waveguide output facet;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19921100
