DocumentCode
811164
Title
Tip-chip bonding: solder bonding to the sides of substrates
Author
Chan, W.K. ; Yi-Yan, A. ; Bhat, Ritesh
Author_Institution
Bellcore, Red Bank, NJ, USA
Volume
28
Issue
18
fYear
1992
Firstpage
1730
Lastpage
1732
Abstract
A method of butt coupling a photodetector chip to the output facet of waveguides by solder bonding is described. The critical step of defining contact pads on the facet that are well aligned to the waveguides is carried out with a temporary shadow mask fabricated in situ. All of the light emerging from the waveguide is collected with little sensitivity to wavelength, polarisation and details of the device structure.
Keywords
integrated optics; integrated optoelectronics; optical waveguides; optical workshop techniques; photodetectors; soldering; butt coupling; contact pads; photodetector chip; solder bonding; temporary shadow mask; tip chip bonding; waveguide output facet;
fLanguage
English
Journal_Title
Electronics Letters
Publisher
iet
ISSN
0013-5194
Type
jour
DOI
10.1049/el:19921100
Filename
158560
Link To Document