• DocumentCode
    811397
  • Title

    Simulating program disturb faults in flash memories using SPICE compatible electrical model

  • Author

    Mohammad, Mohammad Gh ; Saluja, Kewal K.

  • Author_Institution
    Dept. of Comput. Eng., Kuwait Univ., Safat, Kuwait
  • Volume
    50
  • Issue
    11
  • fYear
    2003
  • Firstpage
    2286
  • Lastpage
    2291
  • Abstract
    Electrical simulation is an important tool that enables designers to evaluate different design alternatives and assess their performance. In memory technology, these tools are used to study the performance of different cell structures and implementations. In this paper we use such simulations to study the impact of defects on the performance of flash memory bitcells. In particular, using a device level simulator, we develop a SPICE compatible model to simulate the operation of a 1T flash bitcell. We then describe a fault injection technique that can be used, in conjunction with the model, to simulate faulty cell behavior. The model is used to simulate different defects in the oxide layer of the flash core memory element. The impact of defects on bitcell behavior under disturb and normal operations is investigated and evaluated. The model is demonstrated to be valuable to evaluate the appropriateness of the logic tests and stress tests used to detect such defects in flash memories.
  • Keywords
    MOSFET; SPICE; failure analysis; fault simulation; flash memories; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; semiconductor device models; MOSFET model; SPICE compatible electrical model; cell structures; defect impact; device level simulator; electrical simulation; fault injection technique; faulty cell behavior simulation; flash core memory element; flash memories; flash memory bitcells; floating gate transistor; logic tests; normal operation; oxide layer defects; program disturb faults; stress tests; Conducting materials; EPROM; Flash memory; Insulation; Logic testing; Nonvolatile memory; Power supplies; SPICE; Stress; Tunneling;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2003.816546
  • Filename
    1239061