DocumentCode
811441
Title
Ultra High-Stress Liner Comprising Diamond-Like Carbon for Performance Enhancement of p-Channel Multiple-Gate Transistors
Author
Tan, Kian-Ming ; Yang, Mingchu ; Liow, Tsung-Yang ; Lee, Rinus Tek Po ; Yeo, Yee-Chia
Author_Institution
Logic Device Technol. Team, Chartered Semicond. Manuf., Singapore
Volume
56
Issue
6
fYear
2009
fDate
6/1/2009 12:00:00 AM
Firstpage
1277
Lastpage
1283
Abstract
We report the demonstration of strained p-channel multiple-gate transistors or FinFETs with a novel liner-stressor material comprising diamond-like carbon (DLC). In this work, a DLC film with very high intrinsic compressive stress up to 6 GPa was employed. For FinFET devices having a 20 nm thin DLC liner stressor, more than 30% enhancement in saturation drain current IDsat is observed over FinFETs without a DLC liner. The performance enhancement is attributed to the coupling of compressive stress from the DLC liner to the channel, leading to hole mobility improvement. Due to its extremely high intrinsic stress value, significant IDsat enhancement is observed even when the thickness of the DLC film deposited is less than 40 nm. The DLC liner stressor is a promising stressor material for performance enhancement of p-channel transistors in future technology nodes.
Keywords
MOSFET; diamond-like carbon; hole mobility; FinFET; high-stress liner comprising diamond-like carbon; hole mobility; intrinsic compressive stress; liner-stressor material; p-channel multiple-gate transistors; p-channel transistors; saturation drain current; Capacitive sensors; Compressive stress; Contacts; Diamond-like carbon; Etching; FinFETs; Microelectronics; Organic materials; Scalability; Silicon compounds; Contact etch stop layer (CESL); FinFET; diamond-like carbon (DLC); multiple-gate; strain;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2009.2019388
Filename
4908950
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