• DocumentCode
    811441
  • Title

    Ultra High-Stress Liner Comprising Diamond-Like Carbon for Performance Enhancement of p-Channel Multiple-Gate Transistors

  • Author

    Tan, Kian-Ming ; Yang, Mingchu ; Liow, Tsung-Yang ; Lee, Rinus Tek Po ; Yeo, Yee-Chia

  • Author_Institution
    Logic Device Technol. Team, Chartered Semicond. Manuf., Singapore
  • Volume
    56
  • Issue
    6
  • fYear
    2009
  • fDate
    6/1/2009 12:00:00 AM
  • Firstpage
    1277
  • Lastpage
    1283
  • Abstract
    We report the demonstration of strained p-channel multiple-gate transistors or FinFETs with a novel liner-stressor material comprising diamond-like carbon (DLC). In this work, a DLC film with very high intrinsic compressive stress up to 6 GPa was employed. For FinFET devices having a 20 nm thin DLC liner stressor, more than 30% enhancement in saturation drain current IDsat is observed over FinFETs without a DLC liner. The performance enhancement is attributed to the coupling of compressive stress from the DLC liner to the channel, leading to hole mobility improvement. Due to its extremely high intrinsic stress value, significant IDsat enhancement is observed even when the thickness of the DLC film deposited is less than 40 nm. The DLC liner stressor is a promising stressor material for performance enhancement of p-channel transistors in future technology nodes.
  • Keywords
    MOSFET; diamond-like carbon; hole mobility; FinFET; high-stress liner comprising diamond-like carbon; hole mobility; intrinsic compressive stress; liner-stressor material; p-channel multiple-gate transistors; p-channel transistors; saturation drain current; Capacitive sensors; Compressive stress; Contacts; Diamond-like carbon; Etching; FinFETs; Microelectronics; Organic materials; Scalability; Silicon compounds; Contact etch stop layer (CESL); FinFET; diamond-like carbon (DLC); multiple-gate; strain;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2009.2019388
  • Filename
    4908950