• DocumentCode
    81156
  • Title

    Exploration of Electrical and Novel Optical Chip-to-Chip Interconnects

  • Author

    Wulong Liu ; Yu Wang ; Xue Feng ; Yidong Huang ; Huazhong Yang ; Yuan Xie ; Guoqing Chen

  • Author_Institution
    Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
  • Volume
    31
  • Issue
    5
  • fYear
    2014
  • fDate
    Oct. 2014
  • Firstpage
    28
  • Lastpage
    35
  • Abstract
    Off-chip interconnect is often a bottleneck due to its limited number of pins and bandwidth. The authors present an optical orbital angular momentum (OAM)-based wireless interchip interconnect and compare it with traditional electrical and optical interconnect alternatives.
  • Keywords
    angular momentum; integrated optoelectronics; optical interconnections; OAM-based wireless interchip interconnect; electrical chip-to-chip interconnects; off-chip interconnect; optical chip-to-chip interconnects; optical orbital angular momentum; Bandwidth; Data communication; Integrated circuit interconnections; Laser beams; Multicore processing; Nanophotonics; Optical fibers; Optical interconnections; Silicon;
  • fLanguage
    English
  • Journal_Title
    Design & Test, IEEE
  • Publisher
    ieee
  • ISSN
    2168-2356
  • Type

    jour

  • DOI
    10.1109/MDAT.2014.2336217
  • Filename
    6849444
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=81156