Title :
Exploration of Electrical and Novel Optical Chip-to-Chip Interconnects
Author :
Wulong Liu ; Yu Wang ; Xue Feng ; Yidong Huang ; Huazhong Yang ; Yuan Xie ; Guoqing Chen
Author_Institution :
Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
Abstract :
Off-chip interconnect is often a bottleneck due to its limited number of pins and bandwidth. The authors present an optical orbital angular momentum (OAM)-based wireless interchip interconnect and compare it with traditional electrical and optical interconnect alternatives.
Keywords :
angular momentum; integrated optoelectronics; optical interconnections; OAM-based wireless interchip interconnect; electrical chip-to-chip interconnects; off-chip interconnect; optical chip-to-chip interconnects; optical orbital angular momentum; Bandwidth; Data communication; Integrated circuit interconnections; Laser beams; Multicore processing; Nanophotonics; Optical fibers; Optical interconnections; Silicon;
Journal_Title :
Design & Test, IEEE
DOI :
10.1109/MDAT.2014.2336217
