Abstract :
Summary form only given. The state of the art was discussed in terms of costs, densities, speeds, sizes, yields, rework, testing methodologies, and thermal capabilities for the principle production interconnects. Comparisons were made for each of the newer MCM (multichip module) technologies for which data are available. Observations about costs, reworkability, assembly methods, yields, and testing were made to indicate the author´s views on where and how costs for MCMs can be driven down to become competitive with existing interconnect systems
Keywords :
integrated circuit technology; modules; packaging; technological forecasting; MCM; assembly methods; costs; densities; multichip modules; production interconnects; rework; sizes; speeds; testing methodologies; thermal capabilities; yields; Active matrix technology; Costs; Delay; Dielectric substrates; Liquid crystal displays; Multichip modules; Silicon compounds; Thermal management; Thin film transistors; Wiring;
