DocumentCode :
811991
Title :
A review of the techniques used for modeling single-event effects in power MOSFETs
Author :
Johnson, G.H. ; Palau, J.-M. ; Dachs, C. ; Galloway, K.F. ; Schrimpf, R.D.
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Volume :
43
Issue :
2
fYear :
1996
fDate :
4/1/1996 12:00:00 AM
Firstpage :
546
Lastpage :
560
Abstract :
Heavy ions can trigger catastrophic failure modes in power metal-oxide-semiconductor field-effect transistors (MOSFETs). Single-event effects (SEE), namely, single-event burnout (SEB), and single-event gate rupture (SEGR), of power MOSFETs are catastrophic failure mechanisms that are initiated by the passage of a heavy ion through the device structure. Various analytical, semianalytical, and simulation models have been developed to help explain these phenomena. This paper presents a review of these models and explains their merits and limitations. New results are included to illustrate the approaches
Keywords :
avalanche breakdown; digital simulation; ion beam effects; power MOSFET; semiconductor device models; space vehicle electronics; catastrophic failure modes; current induced avalanche; drain body avalanche; heavy ions; power MOSFET; power metal-oxide-semiconductor field-effect transistor; simulation models; single-event burnout; single-event effects; single-event gate rupture; space environment; Analytical models; Dielectric breakdown; FETs; Failure analysis; Feedback; MOSFET circuits; Neck; Power MOSFET; Protons; Vents;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.490900
Filename :
490900
Link To Document :
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