DocumentCode
812286
Title
High-transconductance InGaAs/InAlAs SISFETs
Author
Jackson, Thomas N. ; Solomon, Paul M. ; Tischler, M.A. ; Bucchignano, J.J. ; Wind, S.J.
Author_Institution
IBM Thomas J. Watson Res. Center, Yorktown Heights, NY
Volume
38
Issue
12
fYear
1991
fDate
12/1/1991 12:00:00 AM
Firstpage
2703
Lastpage
2704
Abstract
Summary form only given. SISFETs in the InGaAs/InAlAs lattice-matched-to-InP material system with record transconductance have been fabricated. These devices use an InGaAs channel layer grown on an InAlAs buffer layer grown on (and lattice matched to) a semi-insulating InP substrate. Carriers are induced in the undoped channel layer by the action of a doped InGaAs gate layer acting across an undoped InAlAs insulating layer. The device is thus the analog of the GaAs/AlGaAs SISFET (or more broadly the silicon gate MOSFET) but provides the electron transport advantages of InGaAs. In addition, ion implantation and arsine overpressure rapid thermal annealing of shallow implants into InGaAs were studied, and it was found that shallow self-aligning implantation structures can be achieved with much lower resistance than in GaAs
Keywords
III-V semiconductors; aluminium compounds; annealing; gallium arsenide; indium compounds; insulated gate field effect transistors; ion implantation; semiconductor epitaxial layers; substrates; InAlAs buffer layer; InAlAs insulating layer; InGaAs channel; InGaAs gate layer; InGaAs-InAlAs; SISFETs; ion implantation; lattice-matched-to-InP; rapid thermal annealing; resistance; semi-insulating InP substrate; semiconductors; shallow self-aligning implantation structures; transconductance; Buffer layers; Gallium arsenide; Indium compounds; Indium gallium arsenide; Indium phosphide; Insulation; Lattices; Silicon; Thermal resistance; Transconductance;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.158725
Filename
158725
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