• DocumentCode
    812286
  • Title

    High-transconductance InGaAs/InAlAs SISFETs

  • Author

    Jackson, Thomas N. ; Solomon, Paul M. ; Tischler, M.A. ; Bucchignano, J.J. ; Wind, S.J.

  • Author_Institution
    IBM Thomas J. Watson Res. Center, Yorktown Heights, NY
  • Volume
    38
  • Issue
    12
  • fYear
    1991
  • fDate
    12/1/1991 12:00:00 AM
  • Firstpage
    2703
  • Lastpage
    2704
  • Abstract
    Summary form only given. SISFETs in the InGaAs/InAlAs lattice-matched-to-InP material system with record transconductance have been fabricated. These devices use an InGaAs channel layer grown on an InAlAs buffer layer grown on (and lattice matched to) a semi-insulating InP substrate. Carriers are induced in the undoped channel layer by the action of a doped InGaAs gate layer acting across an undoped InAlAs insulating layer. The device is thus the analog of the GaAs/AlGaAs SISFET (or more broadly the silicon gate MOSFET) but provides the electron transport advantages of InGaAs. In addition, ion implantation and arsine overpressure rapid thermal annealing of shallow implants into InGaAs were studied, and it was found that shallow self-aligning implantation structures can be achieved with much lower resistance than in GaAs
  • Keywords
    III-V semiconductors; aluminium compounds; annealing; gallium arsenide; indium compounds; insulated gate field effect transistors; ion implantation; semiconductor epitaxial layers; substrates; InAlAs buffer layer; InAlAs insulating layer; InGaAs channel; InGaAs gate layer; InGaAs-InAlAs; SISFETs; ion implantation; lattice-matched-to-InP; rapid thermal annealing; resistance; semi-insulating InP substrate; semiconductors; shallow self-aligning implantation structures; transconductance; Buffer layers; Gallium arsenide; Indium compounds; Indium gallium arsenide; Indium phosphide; Insulation; Lattices; Silicon; Thermal resistance; Transconductance;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.158725
  • Filename
    158725