DocumentCode :
812794
Title :
Dual functional distribution of failure in GaAs multichip microwave monolithic integrated circuits (MMICs)
Author :
Christou, Aris ; Tang, Pin F. ; Hu, Jun Ming
Author_Institution :
Maryland Univ., College Park, MD, USA
Volume :
39
Issue :
10
fYear :
1992
fDate :
10/1/1992 12:00:00 AM
Firstpage :
2229
Lastpage :
2234
Abstract :
A definitive separation of bimodal failure distribution functions for MMICs has been obtained as a result of microwave accelerated life testing. The circuit, a 2-8-GHz monolithic amplifier, showed a very strong early failure pattern related only to passive component degradation. Using the concept of multifunctional distribution it was possible to separate the early failure pattern and to relate it to degradation of the off-chip capacitors. The main failure distribution was related to gate and ohmic contact electromigration of the MMIC active components. When the data analysis includes the early failures, a mean time to failure (MTTF) of less than 1×105 is obtained
Keywords :
III-V semiconductors; MMIC; circuit reliability; failure analysis; gallium arsenide; integrated circuit testing; life testing; 2 to 8 GHz; GaAs; MMIC active components; MTTF; SHF; bimodal failure distribution functions; dual functional distribution; early failure pattern; electromigration; mean time to failure; microwave accelerated life testing; microwave monolithic integrated circuits; monolithic amplifier; multichip MMIC; multifunctional distribution; off-chip capacitors; ohmic contact; passive component degradation; Capacitors; Circuits; Degradation; Distribution functions; Electromigration; Gallium arsenide; Life estimation; Life testing; MMICs; Ohmic contacts;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.158792
Filename :
158792
Link To Document :
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