Deep-submicrometer large-angle-tilt implanted drain (LATID) technology

Deep-submicrometer large-angle-tilt implanted drain (LATID) technology is described. It is found by Monte Carlo process simulation and SIMS measurements that a sufficiently long n^- region can be formed under the gate by taking advantage of large-angle-tilt implant and successfully without ion channeling by taking care of the implant direction. A design that offsets the n⁺ implant by sidewall spacers to suppress the n⁺-gate overlap to zero while keeping the n^- region fully overlapped with the gate is found to be crucial for improved performance and reliability. The device performance, such as current drivability and short-channel effects, is described, and the circuit speed is investigated. Hot-carrier effects such as lateral electric field and device lifetime over a wide range of drain structures are also investigated. The tradeoff between device performance and hot-carrier reliability in deep-submicrometer LATID FETs is discussed