DocumentCode
813194
Title
Differential Sensing of Substrate Noise in Mixed-Signal 0.18-
BiCMOS Technology
Author
Dai, Haitao ; Knepper, Ronald W.
Author_Institution
Dept. of Electr. & Comput. Eng., Boston Univ., Boston, MA
Volume
29
Issue
8
fYear
2008
Firstpage
898
Lastpage
901
Abstract
This paper presents an experimental study of substrate noise isolation in BF-Moat and P+/DT/n-well/DT/P+ guard-ring-defined regions on a lightly doped substrate in the IBM 0.18-mum 7WL bipolar CMOS (BiCMOS) technology. Measurements of substrate noise voltage intentionally generated by an RF power amplifier and 64 digital pad drivers placed on the chip were taken at ten locations throughout the chip, using a capacitively coupled BiCMOS differential sensor circuit. The data show that both isolation structures exhibit effective ability to block out substrate noise for frequencies up to 2-3 GHz. Peak induced substrate noise voltage within the ldquoquiet regionsrdquo was lower by 12-15 dB from that outside the quiet areas.
Keywords
BiCMOS integrated circuits; bipolar integrated circuits; integrated circuit noise; mixed analogue-digital integrated circuits; power amplifiers; radiofrequency amplifiers; sensors; BF-Moat; BiCMOS differential sensor circuit; RF power amplifier; differential sensing; digital pad drivers; frequency 2 GHz to 3 GHz; loss 12 dB to 15 dB; mixed-signal bipolar CMOS technology; n-well guard ring; size 0.18 mum; substrate noise isolation; BiCMOS integrated circuits; CMOS technology; Circuit noise; Isolation technology; Noise generators; Noise measurement; Power generation; Power measurement; Semiconductor device measurement; Voltage; Crosstalk; deep trench; guard ring; isolation technology; n-well guard ring; substrate noise;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2008.2000842
Filename
4571144
Link To Document