• DocumentCode
    813334
  • Title

    Plasma stream homogeneity in metal plasma immersion ion implantation and deposition

  • Author

    Mändl, Stephan ; Rauschenbach, Bernds

  • Author_Institution
    Leibniz Inst. for Surface Modification, Leipzig, Germany
  • Volume
    31
  • Issue
    5
  • fYear
    2003
  • Firstpage
    968
  • Lastpage
    972
  • Abstract
    The homogeneity of metal plasma immersion ion implantation and deposition (MePIIID) was investigated for flat substrates and the materials systems Al, AlN, Ti, TiN, TiO2, and ZnO. A shield was installed in the line-of-sight between the cathode and substrates (diameter 60 and 100 mm) to reduce macroparticle counts. An influence of pulse voltage, cathode material, and backfill on the lateral homogeneity was observed so the plasma stream emanating from the arc as well as the plasma sheath evolving around the substrates contributed to the radial homogeneity in MePIIID. The major factor was the ratio of the sheath width to the sample diameter, with additional influences from the ion velocity and mean free path. For small, conformal sheaths, a normal ion incidence was observed for the substrate, whereas larger, spherical sheaths resulted in oblique ion trajectories near the edge, with an increased sputter yield and lower dose.
  • Keywords
    plasma deposition; plasma immersion ion implantation; Al; AlN; Ti; TiN; TiO2; ZnO; cathode; cathode material; conformal sheaths; ion velocity; macroparticle counts; materials systems; mean free path; metal plasma immersion ion implantation and deposition; normal ion incidence; oblique ion trajectories; plasma stream; plasma stream homogeneity; pulse voltage; spherical sheaths; substrates; Cathodes; Plasma accelerators; Plasma density; Plasma immersion ion implantation; Plasma materials processing; Plasma properties; Plasma sheaths; Plasma sources; Spectroscopy; Substrates;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/TPS.2003.818417
  • Filename
    1240044