• DocumentCode
    813351
  • Title

    A Compact Model for Oxide Breakdown Failure Distribution in Ultrathin Oxides Showing Progressive Breakdown

  • Author

    Tous, Santi ; Wu, Ernest Y. ; Sune, Jordi

  • Author_Institution
    Dept. d´´Eng. Electron., Univ. Autonoma de Barcelona, Barcelona
  • Volume
    29
  • Issue
    8
  • fYear
    2008
  • Firstpage
    949
  • Lastpage
    951
  • Abstract
    The cumulative distribution of the failure time, which includes the time to first breakdown (BD) and the progressive current growth time, is the function of interest for reliability of ultrathin gate oxides. Depending on oxide area and stress conditions, oxide failure is determined by a single BD spot or by multiple competing spots. In this letter, we present an analytical compact model for the final failure distribution which is valid for any failure percentile and which is applicable to both the single and the multiple BD spot limits. This model is intended to be the core of a reliability assessment methodology either for the SiO2-based or high-k gate insulators of interest for the hp45 technology node and beyond.
  • Keywords
    failure analysis; high-k dielectric thin films; semiconductor device breakdown; semiconductor device reliability; cumulative failure distribution; high-k gate insulators; oxide breakdown failure distribution; reliability assessment methodology; ultrathin gate oxides; ultrathin oxides; Analytical models; CMOS technology; Electric breakdown; Failure analysis; High K dielectric materials; High-K gate dielectrics; Insulation; MOS devices; Microelectronics; Stress; Dielectric breakdown (BD); MOS devices; reliability theory;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2008.2001178
  • Filename
    4571158