DocumentCode
813377
Title
Improvement of Heat Dissipation Capability of Slow-Wave Structure Using Two Assembling Methods
Author
Han, Yong ; Liu, Yan-Wen ; Ding, Yao-Gen ; Liu, Pu-Kun
Author_Institution
Inst. of Electron., Chinese Acad. of Sci., Beijing
Volume
29
Issue
8
fYear
2008
Firstpage
955
Lastpage
956
Abstract
Two assembling methods, i.e., the sputter brazing method and the diffusion brazing method, have been developed for improving the heat dissipation capability of the helix traveling-wave tube slow-wave structure (SWS). The magnetron sputter plating technology and the pressure diffusion technology are employed in this letter to complete the SWS assembly. The effect of these two methods on the thermal conduction of the SWS was verified by several experimental tests. These two methods being pursued enable better heat dissipation capability of the helix SWS, compared to the conventional nonbrazing methods.
Keywords
assembling; brazing; cooling; heat conduction; slow wave structures; SWS assembly; assembling methods; diffusion brazing method; heat dissipation capability; helix traveling-wave tube slow-wave structure; magnetron sputter plating technology; pressure diffusion technology; sputter brazing method; thermal conduction; Assembly; Ceramics; Copper; Helium; Power generation; Stability; Temperature; Testing; Thermal conductivity; Thermal resistance; Assembling method; heat dissipation capability; magnetron sputter; pressure diffusion; slow-wave structure (SWS);
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2008.2001350
Filename
4571160
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