DocumentCode
813386
Title
Simulation of the sputtered atom transport during a pulse deposition Process in single- and dual-magnetron systems
Author
Kuzmichev, Anatoly ; Goncha, Igor
Author_Institution
Kiev Polytech. Inst., Nat. Tech. Univ. of Ukraine, Ukraine
Volume
31
Issue
5
fYear
2003
Firstpage
994
Lastpage
1000
Abstract
Results are presented for Monte Carlo simulation of the sputtered atom transport in systems with one and two magnetrons operating in pulse mode. The magnetron system geometry as well as gas pressure and the gap between the targets and substrate strongly influence the features of the forward and backward sputtered atom flows, time behavior, and energy of depositing atoms. The shape of current pulses affects the modulation level of the atom flows that is higher in the case of triangular pulses. The magnetron systems, with inclined targets and a V-shaped target, feature the higher efficiency of atom transport (as compared with the dual coplanar target system or an ordinary one with the flat target) due to the decrease of the atom loss on the chamber walls and shortening the path of the sputtered atoms to the substrate.
Keywords
Monte Carlo methods; plasma materials processing; plasma simulation; sputter deposition; Monte Carlo simulation; V-shaped target; atom transport; backward sputtered atom; chamber walls; depositing atoms; dual coplanar target system; dual-magnetron systems; forward sputtered atom; gas pressure; magnetron systems; pulse deposition process; single-magnetron systems; sputtered atom transport; triangular pulses; Atomic layer deposition; Cathodes; Chemical technology; Magnetrons; Power supplies; Pulse modulation; Pulse shaping methods; Pulsed power supplies; Sputtering; Substrates;
fLanguage
English
Journal_Title
Plasma Science, IEEE Transactions on
Publisher
ieee
ISSN
0093-3813
Type
jour
DOI
10.1109/TPS.2003.818451
Filename
1240049
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