• DocumentCode
    813386
  • Title

    Simulation of the sputtered atom transport during a pulse deposition Process in single- and dual-magnetron systems

  • Author

    Kuzmichev, Anatoly ; Goncha, Igor

  • Author_Institution
    Kiev Polytech. Inst., Nat. Tech. Univ. of Ukraine, Ukraine
  • Volume
    31
  • Issue
    5
  • fYear
    2003
  • Firstpage
    994
  • Lastpage
    1000
  • Abstract
    Results are presented for Monte Carlo simulation of the sputtered atom transport in systems with one and two magnetrons operating in pulse mode. The magnetron system geometry as well as gas pressure and the gap between the targets and substrate strongly influence the features of the forward and backward sputtered atom flows, time behavior, and energy of depositing atoms. The shape of current pulses affects the modulation level of the atom flows that is higher in the case of triangular pulses. The magnetron systems, with inclined targets and a V-shaped target, feature the higher efficiency of atom transport (as compared with the dual coplanar target system or an ordinary one with the flat target) due to the decrease of the atom loss on the chamber walls and shortening the path of the sputtered atoms to the substrate.
  • Keywords
    Monte Carlo methods; plasma materials processing; plasma simulation; sputter deposition; Monte Carlo simulation; V-shaped target; atom transport; backward sputtered atom; chamber walls; depositing atoms; dual coplanar target system; dual-magnetron systems; forward sputtered atom; gas pressure; magnetron systems; pulse deposition process; single-magnetron systems; sputtered atom transport; triangular pulses; Atomic layer deposition; Cathodes; Chemical technology; Magnetrons; Power supplies; Pulse modulation; Pulse shaping methods; Pulsed power supplies; Sputtering; Substrates;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/TPS.2003.818451
  • Filename
    1240049