DocumentCode :
813901
Title :
The power grid transient simulation in linear time based on 3-D alternating-direction-implicit method
Author :
Lee, Yu-Min ; Chen, Charlie Chung-Ping
Author_Institution :
Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsin-Chu, Taiwan
Volume :
22
Issue :
11
fYear :
2003
Firstpage :
1545
Lastpage :
1550
Abstract :
The rising power consumption and clock frequency of very large scale integration technology demand robust and stable power delivery. Extensive transient simulations on large-scale power delivery structures are required to analyze power delivery fluctuation caused by dynamic IR drop and Ldi/dt drop as well as package and on-chip resonance. In this paper, we develop a novel and efficient transient simulation algorithm for the power distribution networks. Our algorithm, three-dimensional (3-D) transmission-line-modeling alternating-direction-implicit (TLM-ADI) method, first models the power delivery structure as 3-D transmission line shunt-node structure and transfers those equations to the telegraph equation. Finally, we solve it by the alternating direction implicit method. The 3-D TLM-ADI method, with linear runtime and memory requirement, is also unconditionally stable, which ensures that the time steps are not limited by any stability requirement. Extensive numerical simulation results show that the proposed algorithm is not only over 300 000 times faster than SPICE but also extremely memory saving and accurate.
Keywords :
VLSI; circuit simulation; integrated circuit modelling; integrated circuit packaging; low-power electronics; transient analysis; 3D alternating-direction-implicit method; clock frequency; linear runtime; linear time; memory requirement; on-chip resonance; package resonance; power consumption; power delivery fluctuation; power grid transient simulation; telegraph equation; transmission-line-modeling alternating-direction-implicit method; very large scale integration; Analytical models; Clocks; Energy consumption; Equations; Frequency; Power grids; Power system transients; Robustness; Transient analysis; Very large scale integration;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/TCAD.2003.818373
Filename :
1240092
Link To Document :
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