Title :
A 2-bit RF MEMS phase shifter in a thick-film BGA ceramic package
Author :
Varian, K. ; Walton, D.
Author_Institution :
Raytheon Syst. Co., Dallas, TX, USA
Abstract :
The development of a thick-film hermetic BGA package for a radio-frequency (RF) microelectromechanical systems (MEMS) 2-bit phase shifter is presented. The measured packaged MEMS phase shifter average in-band insertion loss was 1.14 dB with an average return loss of 15.9 dB. The package transition insertion loss was less than 0.1 dB per transition with excellent agreement between simulated and measured results. It was also demonstrated that the RF MEMS phase shift performance could be improved to obtain a phase error of less than 3.3 degrees. The first reported measurements of the average rise and fall times associated with a MEMS circuit (in this case a 2-bit phase shifter) were 26 and 70 μs, respectively. The advent of packaged RF MEMS phase shifters will reduce the cost (both design and building) of future phase arrays.
Keywords :
ball grid arrays; ceramic packaging; losses; micromechanical devices; microwave phase shifters; thick film devices; 1.14 dB; 15.9 dB; BGA ceramic package; RF MEMS phase shifter; RF microelectromechanical systems; ball grid arrays; hermetic package; insertion loss; low loss X-band MEMS packaging; phase arrays; radiofrequency MEMS; thick-film BGA package; Ceramics; Insertion loss; Loss measurement; Micromechanical devices; Packaging; Phase measurement; Phase shifters; Phased arrays; Radio frequency; Radiofrequency microelectromechanical systems;
Journal_Title :
Microwave and Wireless Components Letters, IEEE
DOI :
10.1109/LMWC.2002.803201