DocumentCode :
814937
Title :
Sheet resistance measurement of non-standard cleanroom materials using suspended Greek cross test structures
Author :
Enderling, Stefan ; Brown, Charles L. ; Smith, Stewart ; Dicks, Martin H. ; Stevenson, J. Tom M ; Mitkova, Maria ; Kozicki, Michael N. ; Walton, Anthony J.
Author_Institution :
Scottish Microelectron. Centre, Edinburgh Univ., UK
Volume :
19
Issue :
1
fYear :
2006
Firstpage :
2
Lastpage :
9
Abstract :
This paper presents work on the development, fabrication and characterization of a suspended Greek cross measurement platform that can be used to determine the sheet resistance of materials that would contaminate Complementary Metal Oxide Semiconductor (CMOS) processing lines. The arms of the test structures are made of polysilicon/silicon nitride (Si3N4) to provide a carrier for the film to be evaluated and thick aluminum (Al) probe pads for multiple probing. The film to be evaluated is simply blanket deposited onto the structures and because of its design automatically forms a Greek cross structure with (Al) probe pads. To demonstrate its use, 1) gold (Au), 2) copper (Cu), and 3) silver(Ag) loaded chalcogenide glass Agy(Ge30Se70)1-y have been blanket evaporated in various thicknesses onto the platform in the last processing step and autopatterned by the predefined shape of the Greek crosses. The suspension of the platform ensured electrical isolation between the test structure and the surrounding silicon (Si) substrate. The extracted effective resistivity for Au (5.1×10-8 Ω·m), Cu (1.8- 2.5×10-8/ Ω·m) and Agy(Ge30Se70)1-y (2.27×10-5 Ω·m-1.88 Ω·m) agree with values found in articles in the Journal of Applied Physics (1963), the Journalof Physics D: Applied Physics (1976), and the Journalof Non-Crystalline Solids (2003). These results demonstrate that the proposed Greek cross platform is fully capable to measure the sheet resistance of low (Au, Cu) and high Agy(Ge30Se70)1-y resistive materials.
Keywords :
CMOS digital integrated circuits; MIS structures; aluminium; chalcogenide glasses; copper; gold; materials properties; measurement systems; probes; sheet materials; sheet metal processing; silicon compounds; silver; surface contamination; surface resistance; Ag(Ge30Se70); Au; CMOS processing line; Cu; Greek cross platform; Si3N4; Van der Pauw; critical dimension metrology; electrical isolation; loaded chalcogenide glass; materials sheet resistance; multiple probing; nonstandard cleanroom material; polysilicon; predefined shape; self patterning; suspended Greek cross measurement platform; test structure; thick aluminum probe pad; Copper; Electrical resistance measurement; Gold; Materials testing; Physics; Probes; Semiconductor films; Semiconductor materials; Sheet materials; Silicon; Critical dimension metrology; Greek cross; Van der Pauw; nonstandard cleanroom materials; self patterning; sheet resistance; test structure;
fLanguage :
English
Journal_Title :
Semiconductor Manufacturing, IEEE Transactions on
Publisher :
ieee
ISSN :
0894-6507
Type :
jour
DOI :
10.1109/TSM.2005.863248
Filename :
1588856
Link To Document :
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