• DocumentCode
    815580
  • Title

    Performance improvement of an electrothermal microactuator fabricated using Ni-diamond nanocomposite

  • Author

    Tsai, Li-Nuan ; Shen, Guang-Ren ; Cheng, Yu-Ting ; Hsu, Wensyang

  • Author_Institution
    Dept. of Electron. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • Volume
    15
  • Issue
    1
  • fYear
    2006
  • Firstpage
    149
  • Lastpage
    158
  • Abstract
    In this paper, a low-temperature stress-free electrolytic nickel (EL) deposition process with added dispersed diamond nanoparticles (diameter <0.5 μm) is developed to synthesize Ni-diamond nanocomposite for fabricating electrothermal microactuators. Device characterization reveals dramatic performance improvements in the electrothermal microactuator that is made of the nanocomposite, including a reduction in the input power requirement and enhanced operation reliability. In comparison with the microactuator made of pure nickel, the nanocomposite one can save about 73% the power for a 3 μm output displacement and have a longer reversible displacement range, which is prolonged from 1.8 μm to more than 3 μm. Furthermore, the nanocomposite device exhibits no performance degradation after more than 100 testing cycles in the reversible regime. The enhancements increase with the incorporation of the nanodiamond in a nickel matrix, so the Ni-diamond nanocomposite has potential for application in MEMS fabrication.
  • Keywords
    diamond; electrodeposition; microactuators; nanocomposites; nanoparticles; nickel; MEMS fabrication; device characterization; diamond nanoparticles; electrolytic nickel deposition process; electrothermal microactuator; nanocomposite device; operation reliability; performance improvement; power requirement; Degradation; Electrothermal effects; Laboratories; Microactuators; Nanoparticles; Nanoscale devices; Nickel; Optical device fabrication; Temperature; Thermal expansion;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2005.863737
  • Filename
    1588917