• DocumentCode
    816091
  • Title

    Theoretical and Experimental Analyses of Safe Operating Area (SOA) of 1200-V 4H-SiC BJT

  • Author

    Gao, Yan ; Huang, Alex Q. ; Agarwal, Anant K. ; Zhang, Qingchun

  • Author_Institution
    Int. Rectifier Corp., El Segundo, CA
  • Volume
    55
  • Issue
    8
  • fYear
    2008
  • Firstpage
    1887
  • Lastpage
    1893
  • Abstract
    The safe operating area (SOA) of 1200-V SiC bipolar junction transistor (BJT) is investigated by experiments and simulations. The SiC BJT is free of the second breakdown even under the turn-off power density of 3.7 MW/cm2. The theoretical boundary of reverse-biased SOA caused by the false turn-on is obtained by simulations. The short-circuit capability of the 1200-V SiC BJT is also investigated theoretically and experimentally. Self-heating is considered by the nonisothermal simulation, and 1800-K maximum local temperature is the simulated critical temperature of device failure. The surface condition is very critical for short-circuit capability. From simulations, when the interface trap density increases, the critical temperature decreases. This is believed to be the reason why the experimental results show much shorter short-circuit withstand time than the simulation showed.
  • Keywords
    bipolar transistors; short-circuit currents; silicon compounds; wide band gap semiconductors; BJT; SiC; bipolar junction transistor; nonisothermal simulation; safe operating area; self-heating; short-circuit capability; voltage 1200 V; Breakdown voltage; Current density; Electric breakdown; Failure analysis; Insulated gate bipolar transistors; Power electronics; Semiconductor optical amplifiers; Silicon carbide; Stress; Temperature; Safe operating area (SOA); SiC bipolar junction transistor (BJT); short-circuit;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2008.926682
  • Filename
    4578846