DocumentCode :
816121
Title :
An enhanced SPICE MOSFET model suitable for analog applications
Author :
Power, James A. ; Lane, W.A.
Author_Institution :
Nat. Microelectron. Res. Centre, Univ. Coll. Cork, Ireland
Volume :
11
Issue :
11
fYear :
1992
fDate :
11/1/1992 12:00:00 AM
Firstpage :
1418
Lastpage :
1425
Abstract :
A MOSFET model optimized for analog circuit simulation is presented and shown to agree with measured device characteristics, especially device output conductance and transconductance, over a wide range of operation. The widely used SPICE Level 3 (MOS3) model equations were utilized as a starting point in the model development process. The enhanced model (NMOD) exhibits smooth and continuous transitions in the weak to strong inversion region, and in the region between linear and saturation modes of device operation. These smooth transitions improve both the model´s current and conductance prediction accuracy, as well as its convergence properties when used in circuit simulation. This is made possible because a single current equation is utilized for all regions of device operation. The NMOD model accurately characterizes devices over a wide range of geometries, achieving, for example, 1.3% and 4.2% average errors between measured and model IDS and gds characteristics, respectively, for a 20/1.3-μm p-channel device over a 5-V bias range
Keywords :
MOS integrated circuits; SPICE; circuit analysis computing; insulated gate field effect transistors; linear integrated circuits; semiconductor device models; MOS3; SPICE Level 3; SPICE MOSFET model; analog circuit simulation; convergence properties; device output conductance; enhanced model; linear mode operation; model equations; saturation modes; strong inversion region; transconductance; Accuracy; Analog circuits; Circuit simulation; Convergence; Equations; MOSFET circuits; Predictive models; SPICE; Solid modeling; Transconductance;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.177404
Filename :
177404
Link To Document :
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