• DocumentCode
    816171
  • Title

    The effects of device dimensions on the post-breakdown characteristics of ultrathin gate oxides

  • Author

    Wu, Ernest Y. ; Suñé, Jordi

  • Author_Institution
    IBM Microelectron. Div., Essex Junction, VT, USA
  • Volume
    26
  • Issue
    6
  • fYear
    2005
  • fDate
    6/1/2005 12:00:00 AM
  • Firstpage
    401
  • Lastpage
    403
  • Abstract
    The effects of transistor channel length and width on post breakdown (BD) characteristics have been carefully investigated. As channel-length decreases, we have found that the probability of hard breakdown (HBD) increases and the soft breakdown (SBD) stability time decreases. However, these two quantities are found to be relatively insensitive to the channel width for long channel-length devices. Since SBD is unstable and finally causes the device failure, the so-called HBD prevalence ratio methodology has limitations which are particularly important in short-channel length devices. Our findings indicate that dimensional effects should be properly taken into account in the consideration of circuit reliability and for the application of any post-BD methodology.
  • Keywords
    field effect transistors; semiconductor device breakdown; semiconductor device reliability; HBD prevalence ratio methodology; device dimensions; device reliability; dielectric breakdown; hard breakdown probability; post-breakdown characteristics; progressive breakdown; soft breakdown stability time; transistor channel length; transistor channel width; ultrathin gate oxides; Degradation; Digital circuits; Electric breakdown; MOS devices; Microelectronics; Residual stresses; Stability; Statistics; Dielectric breakdown; MOS devices; TDDB; progressive breakdown; reliability; soft and hard breakdowns;
  • fLanguage
    English
  • Journal_Title
    Electron Device Letters, IEEE
  • Publisher
    ieee
  • ISSN
    0741-3106
  • Type

    jour

  • DOI
    10.1109/LED.2005.848072
  • Filename
    1432912