DocumentCode :
816408
Title :
Fins, fans, and form: volumetric limits to air-side heatsink performance
Author :
Holahan, Maurice F.
Author_Institution :
Thermal Packaging Group, IBM, Rochester, MN, USA
Volume :
28
Issue :
2
fYear :
2005
fDate :
6/1/2005 12:00:00 AM
Firstpage :
255
Lastpage :
262
Abstract :
In design of high performance heatsinks, it is vital to understand how the primary constraints of volumetric footprint and hydraulic operating point limit maximum thermal performance. This paper provides a framework to establish a priori maximum attainable levels of air-side cooling performance for a given class of fin geometry over a basis of continuously varied footprint and hydraulic constraints. A model of packaging volume required for air moving devices to deliver flow and pressure is developed. It is shown how single fin thermal model results may be extrapolated to multiple fan-heatsink combinations within an open design space. A method to identify fin-fan combinations to achieve maximum system volumetric conductance levels is presented. The methodology is extendable to other volumetrically constrained heat exchanger problems.
Keywords :
cooling; electronics packaging; heat exchangers; heat sinks; air moving devices; air-side cooling performance; electronics cooling; fin geometry; heat exchange problems; heat sink; hydraulic constraints; multiple fan-heat sink; open design space; packaging volume model; single fin thermal model; thermal heatsink; volumetric conductance levels; Cogeneration; Computational fluid dynamics; Cooling; Fans; Heat pumps; Packaging; Shafts; Space heating; Thermal resistance; Trigeneration; Electronics cooling thermal heatsink; heat exchanger; heat exchanger fins; optimization; pumping power; volumetric;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2005.848490
Filename :
1432933
Link To Document :
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