Title :
Tenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems
fDate :
6/1/2005 12:00:00 AM
Abstract :
Describes the above-named upcoming conference event. May include topics to be covered or calls for papers.
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2005.850839
