• DocumentCode
    816644
  • Title

    The Effect of Gate Oxide Processes on the Performance of 4H-SiC MOSFETs and Gate-Controlled Diodes

  • Author

    Wang, Y. ; Tang, Ke ; Khan, Tahir ; Koushik Balasubramanian, Mahalingam ; Naik, Harsh ; Wang, Wei ; Chow, T.P.

  • Author_Institution
    Centre for Integrated Electron., Rensselaer Polytech. Inst., Troy, NY
  • Volume
    55
  • Issue
    8
  • fYear
    2008
  • Firstpage
    2046
  • Lastpage
    2053
  • Abstract
    The effect of different gate oxide processes on the performance of 4H-SiC MOSFETs has been studied. These processes include different gate oxide depositions (high-temperature oxide, low-temperature oxide, and plasma-enhanced chemical vapor deposition oxide) and annealing processes (oxygen, NO, and ). Various MOS device parameters, particularly, threshold voltage, subthreshold slope, field-effect electron mobility, sheet electron carrier concentration, and Hall mobility, are correlated with various process steps.
  • Keywords
    Hall mobility; MOSFET; semiconductor diodes; silicon compounds; wide band gap semiconductors; 4H-SiC MOSFET; Hall mobility; MOS device parameters; SiC; annealing processes; field-effect electron mobility; gate oxide depositions; gate oxide processes; gate-controlled diodes; sheet electron carrier concentration; subthreshold slope; threshold voltage; Annealing; Charge carrier processes; Chemical vapor deposition; Diodes; Electron mobility; MOS devices; MOSFETs; Plasma chemistry; Plasma devices; Threshold voltage; 4H-SiC; Field-effect mobility; gate oxide process; threshold voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2008.926674
  • Filename
    4578892